Home Tech & Startups Domestic Chips Surge: Huawei and Xiaomi Unveil Self-Developed Processors, Sparking a Tech Upgrade
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Domestic Chips Surge: Huawei and Xiaomi Unveil Self-Developed Processors, Sparking a Tech Upgrade

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China’s tech industry is hitting a milestone in chip self-sufficiency. Amid a broader push for semiconductor autonomy, domestic chip capabilities are advancing rapidly, with Huawei and Xiaomi unveiling major self-developed processor breakthroughs that challenge foreign technology dominance and mark a new phase in China’s consumer-electronics chip R&D.

At a flagship launch event in Guangzhou, Huawei returned to the spotlight with its new Kirin 9050 Pro, the first high-performance Chinese chip to adopt “logic folding” under the company’s Tau Scaling Law framework. Unlike traditional planar designs, the architecture stacks logic units in layers and adds vertical interconnects—akin to turning a single-story layout into a duplex with “elevators”—to shorten signal paths, cut latency, and improve performance and power efficiency.

Huawei Launch Event

Huawei reports the Kirin 9050 Pro delivers a 24% gain in single-core performance and a 52% jump in multi-core performance versus prior generations, with overall device performance up about 42% in the Mate XT 2 tri-fold phone that debuts the chip. The Mate XT 2 features an ultra-slim 3.5mm body, a 6.5-inch outer display and a 10.2-inch inner screen when unfolded, and starts at 19,999 yuan, with sales beginning September 12. Richard Yu (Yu Chengdong) hailed it as the “strongest” self-developed Kirin chip to date.

At its autumn launch, Xiaomi showcased its own chip progress, reaffirming a decade-long semiconductor plan. CEO Lei Jun said Xiaomi has cumulatively invested 21 billion yuan in chip R&D so far, with the self-developed Xuanjie O3 AI flagship processor now in commercial use. Two additional chips are slated for mass production in the first half of next year, gradually forming a broader in-house chip matrix.

Xiaomi Launch Event

On the device side, Xiaomi introduced the 18 Fold, a premium “mid-fold” flagship developed over roughly 20 months, priced from 10,999 yuan—the highest starting price in Xiaomi’s phone lineup. It pairs the Xuanjie O3 with a new low-power LPDDR6 memory chip (co-developed with CXMT) and a 6,000 mAh battery, delivering a comprehensive experience upgrade. Beyond phones, Xiaomi unveiled three new models in its “Pengcheng” EV series, with maximum comprehensive range reaching 1,461 km, underscoring simultaneous breakthroughs across phones, chips, and automobiles.

Analysts say the back-to-back unveilings reflect mainland tech firms’ determination to reduce reliance on external technology. With domestic chips moving faster from R&D to commercial deployment, the trend is expected to drive upgrades across the consumer-electronics and smart-vehicle supply chains, becoming a core growth engine for China’s new-tech industries.

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