The Hong Kong Electronics Industry Association (HKEIA) and the Consumer Technology Association (CTA), organizer of CES, held the launch ceremony for “CES Asia Unveiled Hong Kong” on 14 October at the Future Industry Pavilion of the Hong Kong Electronics Fair (Autumn Edition). The two organizations also signed a memorandum of understanding focusing on technology collaboration, application scenario matching, resource integration, and market expansion to help local innovation and technology enterprises connect with the international stage.
The event combined innovative technology showcases, keynote speeches, panel discussions, and business networking, enabling Hong Kong startups to engage with investors, corporate leaders, and industry experts. HKEIA aims to leverage its local industry network together with CTA’s international resources to extend technology demonstrations into commercial matching and overseas market development.

The highlight of the event was the “Startup Pitch Competition,” in which eight shortlisted teams competed. ExoTechHK and EzyGreenPak ultimately shared the championship, securing exhibition qualifications and booths in the Eureka Park startup zone at CES 2027, where they will present their research and development achievements to an international audience.

The two companies target the occupational safety and sustainable packaging markets respectively. ExoTechHK has developed the lightweight wearable exoskeleton EXO-CORE, designed to reduce fatigue, physical strain, and the risk of occupational injuries for manual laborers and frontline workers. EzyGreenPak’s DissolveTech uses plant-based water-soluble materials that, according to the company, dissolve in hot water without generating microplastics. It can also incorporate QR codes or NFC digital material passports to support ESG traceability.

CES 2027 will take place from 6 to 9 January next year in Las Vegas, USA. The two winning enterprises will use the exhibition to connect with overseas buyers, investors, and partners, exploring opportunities for technology commercialization and international business expansion.
Leave a comment